Complete Versatility with High-Throughput X-ray

Articles and Whitepapers | Saturday, April 21st, 2018

While they are essential characteristics of an AOI system, 3D inspection and high speed are just as important for AXI. With time-optimized image acquisition technologies and efficient handling concepts, in-line X-ray performance is continually increasing. Advantageous automation possibilities also exist where... .....read more

NEO Tech Introduces First Commercially Available Hands-Free MIC Assembly Line

Articles and Whitepapers | Saturday, April 21st, 2018

Today, the reliability of gallium nitride (GaN) device technology has improved significantly, making GaN a viable technology for both military and commercial applications. Consequently, integrated circuit (IC) manufacturers generally have migrated to GaN and other advanced semiconductor compounds to address... .....read more

Cleaning Fine Pitch Copper Pillar Flip Chip Packages

Articles and Whitepapers | Saturday, April 21st, 2018

The miniaturization of modern electronics continues to challenge the effectiveness of common cleaning processes and the ability to obtain desired cleaning performance and optimal yield. When soldering the flip chip die to the ball grid array (BGA) interposer, water soluble... .....read more